Our factory in China runs the full pack build: design review, cell matching, BMS integration, welding, enclosure assembly, and a complete aging and test cycle before anything ships. You deal directly with the engineers who build the pack.
Send us your spec →Our line in 20 seconds: automated assembly, robotic module handling, and the aging & test hall.
Standard pack-shop capability, done carefully. We will tell you plainly what we can and cannot do for your application.
Mechanical and electrical layout, busbar and enclosure design, thermal assessment, and a design review with you before tooling or prototype spend.
BMS matched to your cells, form factor and duty cycle — protection parameters, balancing, communication (CAN / RS485 / Bluetooth where supported), and firmware parameter tuning.
Capacity, internal-resistance and voltage grading so every string is matched. Branded or grade-A cells sourced to budget — we state the cell type on the quote, no surprises.
Laser welding for stable low-resistance interconnects on steel and nickel tabs; spot welding where the design calls for it. Weld pull checks sampled per batch.
Formation cycles, charge/discharge aging, capacity verification, protection-function tests and a full end-of-line check. Test data accompanies each batch.
Aluminium and steel enclosures, potting and sealing to the IP rating your application needs, custom labels and branding for OEM programs.
The PACK line, aging racks and test benches are in our own facility in China. We run small prototype batches and repeat production on the same line, so what you validate is what you receive. Email us for a live video tour of the floor any working day.





Send voltage, capacity, dimensions, duty cycle and quantity. You get an engineering response with options and pricing in 48 hours.
A small prototype build to validate fit, firmware and performance in your real application before committing to production.
Repeat production with batch test data, packaged for road or sea freight to Auckland — we handle the battery shipping documentation.